Our Equipment



Fuji GPX-C Printer

FUJI XPF-L

Reflow Oven

Fuji NXT III

Auto Nozzle Cleaner II

3D SPI - Online

AOI i9 inline

AOI i8

ROUTER EM-5700N

Nordson X-Ray

E-Dek Laser Printer

VPD PLUS

PCB Types: Rigid, Flexible, and Rigid-Flex PCBs. MCPCBs, Ceramic PCBs, and FR4 PCBs.
Solder Paste Inspection: Auto 3D solder paste coverage inspection.
Layer Count: We can assemble 1 to 50 layers. (Or according to client requirements)
Minimum Size: 50 x 50 mm. For those PCBs size are smaller than 50 x 50 mm, we would use tools to help.
Maximum Size: For panel board 900 mm x 400 mm
Surface Finishes: Gold Plated, Lead-free, OSP(Organic Solderability Preservative), etc.
Board Shape: We can assemble circular, rectangular, and any opaque shape. While choosing shape other than a rectangle, you will have to De-panel the PCB in an array.
Minimum Order: Please contact our team.
Assembly Options: You can ask for THT, SMT or hybrid mix with both manufacturing process.
Repair & Rework: Repairing and reworking is a very difficult job. You can still contact our team for a better solution.
SMT Production Capacity: We are capable to produce 1 million chips per day in the case of 5 SMT lines.
DIP Production Capacity: We can produce 52,000pcs per month.
Lead Time: The Lead-time depends on the order. However, our usual assembly time is between 1 to 2 weeks. The time can vary on the bases of PCBs assembly complexity.
SMT production capacity: SMT Lines(10 million chips per day (0402, 0201 , 01005with 8 million per day)
Enclosure assembly: 1 Production Lines for enclosure assembly
Fine pitch assembly: Down to 01005, component gaps≧0.3mm